Hyperscale AI Data Center Design-Build Solutions

ESDMC provides design-build solutions for next-generation AI data center facilities engineered to support ultra-high-density compute environments, advanced cooling architectures, and mission-critical uptime requirements. We specialize in facilities designed for AI/ML workloads, GPU clusters, and accelerated computing, where rack densities, thermal loads, and power infrastructure significantly exceed traditional data center benchmarks.

Built for the Next Generation of Compute

AI-driven infrastructure is redefining data center design parameters:

• Rack densities moving from 10–20 kW (traditional) to 80 kW – 300+ kW per rack
• Campus-scale deployments exceeding 100MW+ critical load
• Increasing reliance on liquid cooling (direct-to-chip and immersion)
• Higher demands on power quality, redundancy, and thermal stability

ESDMC aligns design and construction execution with these realities—bridging the gap between conceptual engineering and field-level constructability to deliver facilities that perform under sustained, high-output compute loads.

Core Capabilities

Site Selection, Power Strategy & Feasibility

• Utility capacity analysis (substation proximity, redundancy options, dual-feed viability)
• Evaluation of available MW capacity and interconnection timelines
• Land planning for phased campus deployments
• Flood zone, elevation, and resiliency planning (critical for coastal and hurricane-prone regions)
• Fiber access, latency considerations, and carrier diversity

Mission-Critical Design Coordination

• Integrated coordination across civil, structural, architectural, mechanical, electrical, and controls
• Planning for Tier III / Tier IV-equivalent resiliency strategies
• Space planning for high-density data halls, support infrastructure, and future expansion
• Structural coordination for high floor loading and equipment density
• BIM-driven clash detection and constructability validation

High-Density Cooling Infrastructure

• Design-build execution for liquid cooling-ready environments, including:
  • Direct-to-chip liquid cooling systems
  • Rear door heat exchangers
  • Immersion cooling readiness (single-phase / two-phase)
• Coordination of:
  • CDU (Coolant Distribution Units)
  • Secondary fluid loops
  • Heat rejection systems (cooling towers, dry coolers, hybrid systems)
• Integration of hot aisle / cold aisle containment and hybrid air/liquid strategies
• Mechanical redundancy
• Optimization for PUE reduction and thermal efficiency under variable AI loads

Electrical Infrastructure & Power Distribution

• Utility-to-rack power architecture including:
  • Medium voltage distribution
  • Switchgear and paralleling gear
  • Generators and fuel systems (diesel / alternative fuels)
  • UPS systems (centralized and distributed architectures)
• Design and construction for high-density rack distribution:
• Redundancy strategies:
• Power quality and harmonics mitigation for AI workloads
• Future-proofing for increasing rack densities and evolving hardware requirements

Design-Build Delivery Model

• Single-source accountability from pre-construction through commissioning
• Early procurement strategies for long-lead equipment:
  • Switchgear
  • Generators
  • Cooling systems
• Phased turnover for accelerated deployment of data halls
• Reduced risk through early trade partner integration

Commissioning & Operational Readiness

• Level 1–5 commissioning coordination
• Integrated systems testing (IST)
• Functional performance testing of:
  • Electrical systems
  • Mechanical systems
  • Controls and monitoring systems
• QA/QC processes aligned with mission-critical standards
• Documentation, training, and turnover protocols for operations teams

Why team with us?

• Purpose-built for AI and high-performance computing environments
• Experience coordinating complex MEP systems at scale
• Strong focus on constructability in high-density environments
• Design-build model optimized for speed to market
• Ability to execute in phased, live, or expansion environments
• Deep understanding of thermal, electrical, and spatial constraints in AI facilities